Join us at the Hong Kong Electronics Symposium 2026 to explore “The Next Generation of AI: Powering Mobility and Innovation.” We will gather leading experts from the Chinese Mainland and overseas to share insights on how AI is transforming transportation, smart infrastructure, and industrial systems—an excellent opportunity to connect, learn, and be part of the future of intelligent innovation.

This year’s program will highlight emerging applications that are reshaping global mobility trends. Attendees can also engage with innovators driving forward next‑generation sustainable and smart technologies.