|Project Title:||Multi-Purpose Wireless IoT IC Platform for Enabling Hong Kong Re-Industrialization|
|Hosting Institution:||LSCM R&D Centre (LSCM)|
|Abstract:||The current IoT network in the market is heterogeneous. Specific and dedicated
communication standards such as BLE, Zigbee, Thread, LoRa, etc., are required in
different applications. An efficient solution would be the use of a multi-purpose device
that is capable of communicating with a large number of standards in multiple
frequencies. A multi-purpose RF front-end IC design would enable the industries to
develop versatile IoT products and solutions meeting different market needs.
This project aims to develop a multi-purpose wireless front-end IC design that could
process different IoT standards. It will be a generic architecture of both transmission and
reception which can be easily adapted to support different IoT standards. Our proposed
technologies include a flexible radio front-end and IPs that are able to process a wide
range of signals based on RF CMOS process. We will develop silicon proven RF
transceiver and individual IP, which will be verified through baseband logic on field
programmable gate array (FPGA) platform.
The RFIC IP will become a common critical component in customized IoT device
development works that contributes to Hong Kong’s re-industrialization. It can be
spawned into different specialized product design by integrating with different backend
computing and control logic. With local IC design capabilities, Hong Kong can develop it’
s own specialized and competitive IoT products.
|Project Coordinator:||Mr Martin Chun-Wai LAI|
|Approved Funding Amount:||HK$ 12.87M|
|Project Period:||1 Feb 2023 - 31 Jan 2025|