| Project Reference: | ITP/043/22LP |
| Project Title: | Multi-Purpose Wireless IoT IC Platform for Enabling Hong Kong Re-Industrialization |
| Hosting Institution: | LSCM R&D Centre (LSCM) |
| Abstract: | The current IoT network in the market is heterogeneous. Specific and dedicated communication standards such as BLE, Zigbee, Thread, LoRa, etc., are required in different applications. An efficient solution would be the use of a multi-purpose device that is capable of communicating with a large number of standards in multiple frequencies. A multi-purpose RF front-end IC design would enable the industries to develop versatile IoT products and solutions meeting different market needs. This project aims to develop a multi-purpose wireless front-end IC design that could process different IoT standards. It will be a generic architecture of both transmission and reception which can be easily adapted to support different IoT standards. Our proposed technologies include a flexible radio front-end and IPs that are able to process a wide range of signals based on RF CMOS process. We will develop silicon proven RF transceiver and individual IP, which will be verified through baseband logic on field programmable gate array (FPGA) platform. The RFIC IP will become a common critical component in customized IoT device development works that contributes to Hong Kong’s re-industrialization. It can be spawned into different specialized product design by integrating with different backend computing and control logic. With local IC design capabilities, Hong Kong can develop it’ s own specialized and competitive IoT products. |
| Project Coordinator: | Mr Martin Chun-Wai LAI |
| Approved Funding Amount: | HK$ 12.87M |
| Project Period: | 1 Feb 2023 - 31 Jan 2025 |
