Application and Submission
Applications must be submitted to the Hong Kong R&D Centre for Logistics and Supply Chain Management Enabling Technologies (LSCM) either:
In hard copy in triplicate (one original plus two duplicate copies), in person, or by post. Please also kindly provide a soft copy (preferably in MS Word 2010 or above).
Note: Please note that registration is required before using ITCFAS II to submit the project application.
Please enter “Hong Kong R&D Centre for Logistics and Supply Chain Management Enabling Technologies Limited" in the Organisation Name field on the Registration page.
Please enter the details of the Project Coordinator on the next page and click Submit button to complete the registration process.
LSCM will process the registration within 3 working days after verification.
Please logon to the ITCFAS II with your registered account.
During the submission process, please select Proposal -> Funding Scheme, then select the appropriate Programme, i.e. "ITSP Tier 1" if you select "ITSP – R&D Centre (R&D Projects)" or "TCFS – Category A (1)" if you select "ITSP – Guangdong-Hong Kong Technology Cooperation Funding Scheme."
For project vetting criteria, vetting process and assessment committee, please refer to Project Vetting.
Note: Innovation and Technology Support Programme (ITSP) and Guangdong-Hong Kong Technology Cooperation Funding Scheme (TCFS) provide funding support for two major types of applied R&D projects, namely Platform Projects and Collaborative Projects.
Innovation and Technology Support Programme (ITSP)
Guangdong-Hong Kong Technology Cooperation Funding Scheme (TCFS)
Public Sector Trial Scheme
Commercialization and Intellectual Property (IP) Guidelines for LSCM R&D Projects
ITC Intellectual Property Guide
Please refer to the Guideline on Intellectual Property (IP) Arrangements before submitting your applications.