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APAC Innovation Summit 2017- AIS Robotics

With an aim to provide an exchange platform on the trend of specific technology sectors and ready-for-market innovations, APAC Innovation Summit (“AIS” in short and formerly known as InnoAsia) will adopt a thematic approach covering the following major technology areas with a series of events spreading over the year at Hong Kong Science Park:
 
Riding on the success of the past 12 years, this flagship event of Hong Kong Science and Technology Parks Corporation continues to play an important role in knowledge transfer and business matching, bringing together a world cast of leading experts including academia, decision makers and thought leaders to exchange insights on the latest technology trends. With a total attendance of over 4,000 local and overseas executives in 2016 as well as the support from 130 globally renowned speakers and more than 100 partners from universities, R&D centres, media agencies and industry associations, this annual event has established an international reputation.
 
Featuring keynote speakers from both industry and research community, this will be a forward-looking sharing session which identifies new challenges and trends of robotics. Conference Highlights: 
-Future A.I.
-A.I. ethics
-Industrial application of A.I.      
-Robots leaving the production halls
– opportunities and  challenges
Date: 05 June 2017 - 06 June 2017
Venue: Grand Hall, Convention Centre 3, Science Park
Organiser: Hong Kong Science and Technology Parks Corporation
Supporting Organisation: LSCM R&D Centre
Type: Conference
Language: Cantonese / Mandarin / English
Contact: <p> +852 2629 6840 / &nbsp;<a href="mailto:ais.info@hkstp.org">ais.info@hkstp.org</a></p>
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