Application Forms

Innovation and Technology Support Programme (ITSP)
Guangdong-Hong Kong Technology Cooperation Funding Scheme (TCFS)
Production of Prototypes / Samples and Conducting of Trial Schemes
Guide to LSCM R&D Project Applications
Submission of Applications
Applications must be submitted to the Hong Kong R&D Centre for Logistics and Supply Chain Management Enabling Technologies (LSCM) either:
(a) in hard copy in triplicate (one original plus two duplicate copies) in person or by post. Please also kindly provide a soft copy (preferably in MS Word 2003 or above); or
(b) submit to LSCM through the Innovation and Technology Commission Funding Administrative System (ITCFAS) (https://www3.itf.gov.hk).

Note: Please note that registration is required before using ITCFAS to submit the project application.

To register:
1. Please enter the details of the Project Coordinator on the Register Project Coordinator page.
2. On the same page, please select "Hong Kong R&D Centre for Logistics and Supply Chain Management Enabling Technologies Limited" in the Organization Name field and then enter your "Company Name".
3. Please click the Submit button to complete the registration process.
4. LSCM will process the registration and send login password by email to the above registered email address within 3 working days after verification.

To submit:
1. Please logon to the ITCFAS with the issued password.
2. During the submission process, please select the appropriate Grant Type, i.e. "ITSP – R&D Centre (R&D Projects)" or "ITSP – Guangdong-Hong Kong Technology Cooperation Funding Scheme".
3. Select the appropriate Scheme, i.e. "ITSP Tier 1" if you select "ITSP – R&D Centre (R&D Projects)" or "TCFS – Category A(1)" if you select "ITSP – Guangdong-Hong Kong Technology Cooperation Funding Scheme".